BA-F113SC【PDF 1/2 页】F113SC-NON CONDUCTIVE ADHESIVE

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Technical Data Sheet

TRA-BOND? F113SC?

March - 2009

PRODUCT DESCRIPTION

TRA-BOND? F113SC? provides

characteristics:

the following product

TYPICAL PROPERTIES OF CURED MATERIAL

Physical Properties :

Coefficient of Thermal Expansion cm/cm/oC:

Technology

Appearance (Resin)

Appearance (Hardener)

Appearance (Mixed)

Cure

Product Benefits

Epoxy

Clear

Dark blue

Room temperature cure or Heat cure

? High Tg

? Low viscosity

Below Tg

Above Tg

Glass Transition Temperature (Tg), °C

Hardness, Shore D

Refractive Index

Water Absorption, %

7.57×10 -05

1.91×10 -04

1.52

0.98

? High bond strength

Mix Ratio, by weight -

Resin : Hardener

Operating Temperature

Application

? Low stress connections with no

pistoning

? Dark blue color allow for easy polishing

100 : 30

-60 to 120 °C

Assembly

TYPICAL PERFORMANCE OF CURED MATERIAL

Lap Shear Strength, :

1 hour @ 65°C, psi

24 hours @ 25°C, psi

3,900

2,700

Typical Optic Application

Fiber optic connectors, LED displays,

Lenses and Optoelectronic device

assembly

GENERAL INFORMATION

For safe handling information on this product, consult the

Material Safety Data Sheet, (MSDS).

TRA-BOND? F113SC? is formulated for terminating all types

of fiber optic connectors.

DIRECTIONS FOR USE

1. Carefully clean and dry all surfaces to be bonded

TYPICAL PROPERTIES OF UNCURED MATERIAL

Thixotropic Index

Viscosity @ 25 °C, cP:

After Mixing

Specific Gravity, mixed

Pot Life 25 grams, minutes

Work Life 25 grams, hour

Flash Point - See MSDS

1.0

1,800

1.1

2. Remove clamp and thoroughly mix the TRA-BOND?

F113SC? epoxy adhesive system components in the

handy BIPAX mixing-dispenser package until color is

uniform throughout

3. Apply this completely mixed adhesive to the prepared

surfaces, and gently press these surfaces together.

Contact pressure is adequate for strong, reliable bonds;

however, maintain contact until adhesive is completely

cured

4. Some separation of components is common during

shipping and storage. For this reason, it is recommended

that the contents of the shipping container be thoroughly

mixed prior to use

TYPICAL CURING PERFORMANCE

Cure Schedule

18 hours @ 25°C or

1 hour @ 65°C or

15 minutes @ 90°C (for one drop applications)

Percent Volatiles

VOC, grams/liter 1.91

Sufficient cure in 15 minutes @ 65oC is developed for polishing

connectors.

The above cure profiles are guideline recommendations. Cure

conditions (time and temperature) may vary based on customers'

experience and their application requirements, as well as customer

curing equipment, oven loading and actual oven temperatures.

5. Some ingredients in this formulation provided in BIPAX,

TRA-PAX and bulk packaging may crystallize when

subjected to low temperature storage. A gentle warming

cycle of 52oC for 30 minutes prior to mixing components

may be necessary. Crystallized epoxy components do

not react as well as liquid components and should be

redissolved prior to use for best results

Not for product specifications

The technical data contained herein are intended as reference

only. Please contact your local quality department for

assistance and recommendations on specifications for this

product.

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